Odisha Lands Major Semiconductor Investment
Intel-backed project to bring advanced substrate manufacturing technology to India
- Odisha, Intel and 3DGS sign landmark semiconductor MoU
- Advanced packaging glass substrate facility planned near Bhubaneswar
- Project among India’s largest high-tech manufacturing investments
- Facility expected to boost jobs, exports and semiconductor capabilities
GG News Bureau
New Delhi, 29th May: India received a major boost to its semiconductor ambitions on Thursday as the Government of Odisha signed a landmark Memorandum of Understanding (MoU) with Intel Corporation and 3DGS Inc. to establish an advanced packaging glass core substrate manufacturing facility in the state.
The agreement was signed in the presence of Union Electronics and IT Minister Ashwini Vaishnaw, Odisha Chief Minister Mohan Charan Majhi, Intel CEO Lip-Bu Tan and other dignitaries.
The facility, proposed to be set up in the Bhubaneswar-Khurda region, is being described as one of the largest high-technology manufacturing investments in India and is expected to play a significant role in strengthening the country’s semiconductor ecosystem.
Vaishnaw said the agreement aligns with the government’s vision of developing a complete semiconductor manufacturing ecosystem in India. He noted that growing investments by global technology leaders reflect confidence in India’s policy framework and the progress achieved under the semiconductor mission.
The minister highlighted recent engagements involving major global firms such as Applied Materials, Lam Research, Tokyo Electron, Merck Electronics and the partnership between Tata Electronics and ASML as indicators of industry trust in India.
According to officials, the project will be implemented in phases over the next five to six years and is expected to create substantial direct and indirect employment opportunities in advanced manufacturing and technology sectors.
The facility will focus on manufacturing advanced packaging glass core substrates, high-density interconnect substrates and related semiconductor technologies. Intel will provide technology know-how and process expertise to support the project.
Officials said the initiative is expected to contribute to capability development, supply chain strengthening, export-oriented manufacturing and ecosystem growth while positioning Odisha as an emerging global hub for semiconductor manufacturing and digital infrastructure.
The project forms part of the broader India Semiconductor Mission, which aims to strengthen domestic semiconductor manufacturing, design capabilities and supply-chain resilience.
